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2817166

Name: Bergquist Company 2817166
Brand: Bergquist Company
SKU: 951-2817166
Price: 203.85 HKD
Availability: OutOfStock

Mouser 編號：

951-2817166

製造商編號：

2817166

製造商：

Bergquist Company

說明：

熱介面產品 Higher Performance, High Reliability Insulator, Sil-Pad TSP A3000 / A2000 Series

規格書:

2817166 規格書 (PDF)

ECAD模型:

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供貨情況

庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 5 週工廠預計生產時間。

輸入數量：

最少： 39 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$203.85	HK$7,950.15
	HK$191.14	HK$9,557.00
	HK$178.33	HK$17,833.00
	HK$169.04	HK$42,260.00
	HK$163.86	HK$81,930.00

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商品屬性	屬性值	選擇屬性
製造商:	Bergquist Company
產品類型:	熱介面產品
RoHS:
系列:	A2000 / TSP A3000
品牌:	Bergquist Company
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
產品類型:	Thermal Interface Products
原廠包裝數量:	5000
子類別:	Thermal Management
公司名稱:	Sil-Pad
零件號別名:	TSP A3000-0.015-AC-39
每件重量:	1.864 g

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篩選文檔:

規格書

2817166 規格書 (PDF)

TSP A3000 High Performance SIL PAD®

Bergquist Company TSP A3000 High-Performance SIL PAD^® are conformable elastomers with ultra-high 3W/m.K thermal conductivity that acts as a thermal interface between electrical components and heat sinks. These inductors are designed for applications where optimal heat transfer is required. These thermally conductive silicone elastomers offer a thermal impedance of 0.32°C-in²/W (at 50psi). They are formulated to maximize the thermal and dielectric performance of the filler/binder matrix. This results in a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. Bergquist Company SIL PAD TSP A3000 High-Reliability Insulators are ideal for use in motor drive controls, avionics applications, high-voltage power supplies, and power transistor/heat sink interfaces.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD^® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.