SP400-0.009-AC-12/100

Bergquist Company
951-SP4000.009A12100
SP400-0.009-AC-12/100

製造商：

說明：
熱介面產品 Sil-Pad, 0.009" Thickness, 1 Side Adhesive, 12"x100' Roll, Sil-Pad TSP900/400
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工廠前置作業時間：
4 週 工廠預計生產時間。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$15,384.21 HK$15,384.21
10 報價

商品屬性 屬性值 選擇屬性
Bergquist Company
產品類型: 熱介面產品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Non-standard
Silicone Elastomer
Gray
- 60 C
+ 180 C
228.6 mm
228.6 mm
0.009 in
UL 94 V-0
400 / TSP 900
品牌: Bergquist Company
組裝國家: Not Available
擴散國: Not Available
原產國: US
設計目的: Thermal Insulation
高度: 355.6 mm
產品類型: Thermal Interface Products
大小: 12 in x 100 ft
原廠包裝數量: 1
子類別: Thermal Management
公司名稱: Sil-Pad
零件號別名: BG409445 2189236
每件重量: 5.262 kg
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所選屬性: 0 

                        
Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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