SPA2000-0.015-00-103

Bergquist Company
951-SPA2000001500103
SPA2000-0.015-00-103

製造商：

說明：
熱介面產品 High Performance/Reliability Insulator, 0.015" Thickness, Sil-Pad TSPA3000/A2000

規格書:
ECAD模型:
下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。
更多資訊
瞭解更多關於Bergquist Company SPA2000-0.015-00-103的資訊

供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 164   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$45.46 HK$7,455.44
HK$42.82 HK$10,705.00
HK$41.65 HK$20,825.00
HK$40.18 HK$40,180.00

商品屬性 屬性值 選擇屬性
Bergquist Company
產品類型: 熱介面產品
RoHS:  
Thermally Conductive Insulators
Non-standard
Silicone Elastomer
4 kVAC
White
- 60 C
+ 200 C
0.015 in
UL 94 V-0
A2000 / TSP A3000
品牌: Bergquist Company
組裝國家: Not Available
擴散國: Not Available
原產國: Not Available
產品類型: Thermal Interface Products
原廠包裝數量: 1
子類別: Thermal Management
公司名稱: Sil-Pad
零件號別名: SPA2000-15MIL-NOADHESIVE-103
找到產品:
若要顯示類似商品，請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

USHTS:
8541600060

TSP A3000 High Performance SIL PAD®

Bergquist Company TSP A3000 High-Performance SIL PAD® are conformable elastomers with ultra-high 3W/m.K thermal conductivity that acts as a thermal interface between electrical components and heat sinks. These inductors are designed for applications where optimal heat transfer is required. These thermally conductive silicone elastomers offer a thermal impedance of 0.32°C-in2/W (at 50psi). They are formulated to maximize the thermal and dielectric performance of the filler/binder matrix. This results in a grease-free, conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications. Bergquist Company SIL PAD TSP A3000 High-Reliability Insulators are ideal for use in motor drive controls, avionics applications, high-voltage power supplies, and power transistor/heat sink interfaces.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

發生意外的錯誤。


有問題嗎？ 請瀏覽幫助中心。
有關特定訂單的問題，請登入您的帳戶。

如有其他問題，請致電800-346-6873或發送郵件至 help@mouser.com 與我們聯絡。