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SPK6-0.006-AC-43

Name: Bergquist Company SPK6-0.006-AC-43
Brand: Bergquist Company
SKU: 951-SPK6-0.006-AC-43
Price: 3.81 HKD
Availability: OutOfStock

影像僅供參考
請參閱產品規格

Mouser 編號：

951-SPK6-0.006-AC-43

製造商編號：

SPK6-0.006-AC-43

製造商：

Bergquist Company

說明：

熱介面產品 SIL PAD, Kapton-Based Insulator, 0.006" Thickness, 1 Side Adhesive

規格書:

SPK6-0.006-AC-43 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 6 週工廠預計生產時間。

輸入數量：

最少： 3400 多個： 3400

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$3.81	HK$12,954.00

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商品屬性	屬性值	選擇屬性
製造商:	Bergquist Company
產品類型:	熱介面產品
RoHS:
產品:	Thermally Conductive Insulators
封裝/外殼:	Non-standard
材料:	Silicone Elastomer
擊穿電壓:	6 kVAC
色彩:	Blue-Green
最低工作溫度:	- 60 C
最高工作溫度:	+ 180 C
厚度:	0.006 in
抗張強度:	35 MPa
系列:	K-6 / TSP K1100
品牌:	Bergquist Company
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
產品類型:	Thermal Interface Products
原廠包裝數量:	1
子類別:	Thermal Management
公司名稱:	Sil-Pad
零件號別名:	BG70283 K6AC-43 2167636

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所選屬性: 0

                        
Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

篩選文檔:

Technical Resources

Videos

Video

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD^® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.