TGP40000SF-0.020-01-0406-NA

Bergquist Company
951-TGP400SF.0200146
TGP40000SF-0.020-01-0406-NA

製造商：

說明：
熱介面產品 GAP PAD, Sil-Free, 40W/m-K, 4 x 6" Sheet, Tacky Pad, 0.020" Thickness, Thermexit

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庫存量: 49

庫存：
49
可立即送貨
在途量:
60
工廠前置作業時間：
6
週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$658.58 HK$658.58
HK$619.86 HK$6,198.60
HK$581.14 HK$11,622.80
HK$542.33 HK$32,539.80
HK$522.97 HK$52,297.00

商品屬性 屬性值 選擇屬性
Bergquist Company
產品類型: 熱介面產品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
101.6 mm
0.508 mm
TGP 40000SF
品牌: Bergquist Company
組裝國家: Not Available
擴散國: Not Available
原產國: US
設計目的: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
高度: 4 in
產品類型: Thermal Interface Products
大小: 4 in x 6 in
原廠包裝數量: 20
子類別: Thermal Management
公司名稱: GAP PAD / Thermexit
零件號別名: TGP40000SF-0.020-01-0406 2988063
每件重量: 20 g
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所選屬性: 0

USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.

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