TGP40000SF-0.060-01-0606-NA

Bergquist Company
951-TGP400SF.0600166
TGP40000SF-0.060-01-0606-NA

製造商：

說明：
熱介面產品 GAP PAD, Sil-Free, 40W/m-K, 6 x 6" Sheet, Tacky Pad, 0.060" Thickness, Thermexit

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庫存量: 8

庫存：
8
可立即送貨
在途量:
10
工廠前置作業時間：
7
週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$2,267.29 HK$2,267.29
HK$2,033.91 HK$20,339.10
HK$1,910.23 HK$57,306.90
HK$1,868.29 HK$93,414.50

商品屬性 屬性值 選擇屬性
Bergquist Company
產品類型: 熱介面產品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
152.4 mm
1.524 mm
TGP 40000SF
品牌: Bergquist Company
組裝國家: Not Available
擴散國: Not Available
原產國: US
設計目的: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
高度: 6 in
產品類型: Thermal Interface Products
大小: 6 in x 6 in
原廠包裝數量: 10
子類別: Thermal Management
公司名稱: GAP PAD / Thermexit
零件號別名: TGP40000SF-0.060-01-0606 2987873
每件重量: 60 g
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所選屬性: 0

CAHTS:
3920990000
USHTS:
3920995000
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.

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