CQB-AU100-23um

Chip Quik
910-CQB-AU100-23UM
CQB-AU100-23um

製造商:

說明:
焊料 Gold Bonding Wire (Au100) Gold 23um (0.9mil) (Solid Core)

壽命週期:
新產品:
該製造商的新產品。

供貨情況

庫存:
0

您仍可購買此商品作為延期交貨訂單。

最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$5,730.98 HK$5,730.98

商品屬性 屬性值 選擇屬性
Chip Quik
產品類型: 焊料
RoHS:  
Solder Wire
23 um
Spool
品牌: Chip Quik
組裝國家: Not Available
擴散國: Not Available
原產國: CN
產品類型: Solder
系列: CQB
原廠包裝數量: 1
子類別: Solder & Equipment
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所選屬性: 0

CAHTS:
8311900000
USHTS:
8311900000
JPHTS:
831190000
TARIC:
8311900000
BRHTS:
83119000
ECCN:
EAR99

CQB Gold Bonding Wires

Chip Quik CQB Gold Bonding Wires are made of high-purity gold >99.99% and are designed specifically for wire bonding. These bonding wires are stored in a dry, non-corrosive environment and offer excellent electrical conductivity, stability, and resistance to corrosion. The CQB wires are available in 23µm and 25µm diameters. These wires connect electrical components in industries and electrically connect microchip dies to the terminals of a chip package or directly to a substrate. The CQB bonding wires are RoHS 3 compliant, REACH compliant, and conform to J-STD-006C standard. These wires are used by Integrated Circuit (IC) packaging shops, research labs, and advanced manufacturing facilities. The CQB gold bonding wires are ideal for electronics, aerospace, and medicine.