14L-606-416-AA1

EDAC
587-14L-606-416-AA1
14L-606-416-AA1

製造商:

說明:
集管和線殼 14L Series (.156"(3.96mm) contact spacing) Inline side entry pin header with 6 Tin plated contacts in a single row

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 1,000

庫存:
1,000 可立即送貨
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$3.45 HK$3.45
HK$2.97 HK$29.70
HK$2.65 HK$66.25
HK$2.52 HK$252.00
HK$2.25 HK$562.50
HK$2.14 HK$2,140.00
HK$1.90 HK$5,700.00
HK$1.84 HK$9,200.00
HK$1.79 HK$17,900.00

商品屬性 屬性值 選擇屬性
EDAC
產品類型: 集管和線殼
RoHS:  
Headers
Pin Header
6 Position
3.96 mm (0.156 in)
1 Row
Through Hole
Solder Pin
Right Angle
Pin (Male)
Tin
8 mm (0.315 in)
3.8 mm (0.15 in)
14L
Wire-to-Board
- 25 C
+ 105 C
Bulk
品牌: EDAC
觸點材料: Brass
組裝國家: Not Available
擴散國: Not Available
原產國: CN
额定电流: 7 A
易燃性等級: UL 94 V-0
外殼顏色: Natural
外殼材料: Nylon
絕緣電阻: 1 GOhms
產品類型: Headers & Wire Housings
原廠包裝數量: 1000
子類別: Headers & Wire Housings
額定電壓: 250 VAC/DC
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所選屬性: 0

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CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

14L Series 3.96mm Inline Wire-to-Board Connectors

EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors feature a 3.96mm pitch, 7A current rating, and an operating temperature range of -25°C to +105°C. The insulator material has a UL 94V-0 flammability rating and top- or side-entry configurations. 14L series connectors accept 22AWG to 18AWG wires and offer a 1500VAC dielectric withstanding voltage, 1000MΩ insulation resistance, and 10mΩ maximum contact resistance. EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors are for use with PCB boards of 1.6mm nominal thicknesses.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.