D01-9843201

Harwin
855-D01-9843201
D01-9843201

製造商：

說明：
IC 及元件插座 D01 32P STACKTHROUGH PRESS FIT GOLD

規格書:
ECAD模型:
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庫存量: 24

庫存：
24 可立即送貨
工廠前置作業時間：
8 週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$90.67 HK$90.67
HK$81.62 HK$816.20
HK$76.86 HK$2,305.80
HK$74.88 HK$4,492.80
HK$72.91 HK$7,655.55
HK$65.02 HK$16,580.10
HK$61.07 HK$31,145.70
HK$54.01 HK$54,280.05

商品屬性 屬性值 選擇屬性
Harwin
產品類型: IC 及元件插座
RoHS:  
REACH - SVHC:
DIP / SIP Sockets
32 Position
1 Row
Sub-Miniature Socket
2.54 mm
Solder Pin
Tin
- 55 C
+ 100 C
D01
品牌: Harwin
組裝國家: Not Available
擴散國: Not Available
原產國: GB
安裝風格: PCB
產品類型: IC & Component Sockets
原廠包裝數量: 15
子類別: IC & Component Sockets
每件重量: 1.868 g
找到產品:
若要顯示類似商品，請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

規格書

Technical Resources

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

I.C. D01/D2 Sockets & Socket Strips

Harwin I.C. D01/D2 Sockets and Socket Strips consist of round-pin and wire-wrap I.C. sockets designed to accommodate integrated circuits and other components with connection pins. The machined female contacts have a gold-plated contact finish and are housed in glass-filled thermoplastic for robust insulation and mechanical strength. Tin-plated termination surfaces are designed for through-hole solder and wire-wrap terminations. Harwin I.C. D01/D2 Sockets and Socket Strips are suitable for various electronics, including consumer and automotive, and industrial equipment.

Industrial Solutions

Harwin provides a wide range of industrial solutions that are compatible with industry-standard connector systems. These products are certified to EN9100D/AS9100D, ensuring continual improvement and quality management systems. Included in the available Industrial Solutions are durable industrial connectors, PCB connectors, spring contacts, EMC shielding, PCB sockets, and PCB hardware. Harwin Industrial Solutions are ideal for industrial and factory equipment, data collection, mobile maintenance and display control systems, portable test equipment, and base station communications.

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