F46MR20W3M1HB11BPSA1

Infineon Technologies
726-F46MR20W3M1HB11B
F46MR20W3M1HB11BPSA1

製造商:

說明:
MOSFET模組 EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC

壽命週期:
新產品:
該製造商的新產品。
ECAD模型:
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庫存量: 3

庫存:
3 可立即送貨
工廠前置作業時間:
10 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$4,677.67 HK$4,677.67
HK$4,045.23 HK$32,361.84

商品屬性 屬性值 選擇屬性
Infineon
產品類型: MOSFET模組
RoHS:  
SiC
Press Fit
N-Channel
1 Channel
1.2 kV
470 A
1.91 Ohms
- 7 V, + 20 V
5.15 V
- 40 C
+ 175 C
20 mW
EasyPACK
Tray
品牌: Infineon Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: AT
下降時間: 74 ns
產品: Modules
產品類型: MOSFET Modules
上升時間: 261 ns
原廠包裝數量: 8
子類別: Discrete and Power Modules
標準斷開延遲時間: 276 ns
標準開啟延遲時間: 156 ns
零件號別名: F4-6MR20W3M1H_B11 SP005975717
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CAHTS:
8541210000
USHTS:
8541210095
JPHTS:
854121000
TARIC:
8541210000
MXHTS:
8541210100
ECCN:
EAR99

EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.