FF55MR12W1M1HB70BPSA1

Infineon Technologies
726-FF55MR12W1M1HB70
FF55MR12W1M1HB70BPSA1

製造商:

說明:
離散半導體模組 EASY

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 48

庫存:
48 可立即送貨
工廠前置作業時間:
8 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$469.36 HK$469.36
HK$344.99 HK$3,449.90

商品屬性 屬性值 選擇屬性
Infineon
產品類型: 離散半導體模組
RoHS:  
Si
M1H
Tray
品牌: Infineon Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: AT
產品類型: Discrete Semiconductor Modules
原廠包裝數量: 24
子類別: Discrete Semiconductor Modules
公司名稱: EasyDUAL CoolSiC
零件號別名: FF55MR12W1M1H_B70 SP005852782
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CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
854129000
TARIC:
8541290000
MXHTS:
8541299900
ECCN:
EAR99

EasyDUAL™ 1B IGBT Modules

Infineon Technologies EasyDUAL™ 1B IGBT Modules with CoolSiC™ MOSFETs deliver very low stray inductance and outstanding efficiency enabling higher frequencies, increased power density, and reduced cooling requirements. The 1200V, 8mΩ half-bridge modules feature an integrated NTC temperature sensor and PressFIT contact technology. Thermal interface material is available on the xHP_B11 variants. These devices feature 0 to 5V and +15V to +18V recommended gate drive voltage ranges, maximum gate-source voltages of +23V or -10V, and 17mΩ or 33mΩ drain-source on resistance options. Integrated mounting clamps provide rugged mounting assurance.

1200V CoolSiC™ M1H Modules

Infineon Technologies 1200V CoolSiC™ M1H Modules offer EV Charging and other inverter designers opportunities to achieve never-before-seen efficiency and power density levels.