A17553-060

Laird Technologies
739-A17553-060
A17553-060

製造商：

說明：
熱介面產品 COOLZORB-400,0.060in

規格書:
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供貨情況

庫存：
暫無庫存
工廠前置作業時間：
4 週 工廠預計生產時間。
最少： 5   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$1,614.41 HK$8,072.05
HK$1,525.06 HK$15,250.60
HK$1,452.23 HK$36,305.75
HK$1,443.27 HK$72,163.50
100 報價

商品屬性 屬性值 選擇屬性
Laird Technologies
產品類型: 熱介面產品
RoHS:  
Thermal and EMI Absorbers
Non-standard
1.5 ft
1.5 ft
0.06 in
COOLZORB
Bulk
品牌: Laird Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: US
產品類型: Thermal Interface Products
原廠包裝數量: 1
子類別: Thermal Management
公司名稱: COOLZORB
每件重量: 2.061 kg
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所選屬性: 0

規格書

CNHTS:
8517709001
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

CoolZorb 400 Hybrid Thermal Transfer/EMI Absorber

Laird Technologies CoolZorb 400 Hybrid Thermal / Electromagnetic Interference (EMI) Absorbers suppress unwanted energy coupling, resonances, or surface currents with a 4.5g/cc density. This hybrid absorber / thermal management material is used as a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or a metal chassis. Laird Technologies designs the material using a silicone gel binder that imparts inherent tack typical of standard thermal gap fillers. The filler particle composition provides both good thermal conductivity and EMI suppression in the microwave frequency range, with ideal attenuation performance at or above 5GHz. The soft, compliant pad exerts minimal stress on mating components during assembly while providing good thermal transfer properties due to low interfacial resistance.

CoolZorb Hybrid Thermal EMI Absorbers

Laird Technologies CoolZorb Thermal Interface is a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or a metal chassis. Laird CoolZorb suppresses unwanted energy coupling, resonances, or surface currents, causing board-level EMI issues. The hybrid absorber/thermal management material of the CoolZorb series is designed using a silicone gel binder that imparts inherent tack, typical of standard thermal gap fillers. The filler particle composition imparts thermal conductivity and EMI suppression in the microwave frequency range with high attenuation performance at or above 3GHz. CoolZorb passes UL 94V-0 requirements and is RoHS and REACH compliant.

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