A17557-040

Laird Technologies
739-A17557-040
A17557-040

製造商：

說明：
熱介面產品 COOLZORB-500 0.040in 18.0x18.0in

規格書:
ECAD模型:
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庫存量: 7

庫存：
7
可立即送貨
在途量:
5
工廠前置作業時間：
4
週 工廠預計生產時間數量大於所顯示的數量。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$2,066.34 HK$2,066.34
HK$1,790.40 HK$17,904.00
HK$1,728.01 HK$43,200.25
HK$1,727.76 HK$86,388.00
100 報價

商品屬性 屬性值 選擇屬性
Laird Technologies
產品類型: 熱介面產品
RoHS:  
Thermal and EMI Absorbers
Absorbing Sheet
Non-standard
4 W/m-K
Gray
- 40 C
+ 175 C
457.2 mm
457.2 mm
1.02 mm
17.3 psi
UL 94 V-0
COOLZORB
Bulk
品牌: Laird Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: US
產品類型: Thermal Interface Products
原廠包裝數量: 5
子類別: Thermal Management
公司名稱: COOLZORB
每件重量: 1.157 kg
找到產品:
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所選屬性: 0

規格書

CNHTS:
3919909090
CAHTS:
8547900030
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

CoolZorb 500 Hybrid Thermal/EMI Absorbers

Laird Technologies CoolZorb 500 Hybrid Thermal / Electromagnetic Interference (EMI) Absorbers suppress unwanted energy coupling, resonances, or surface currents with a 3.4g/cc density. The hybrid absorber / thermal management material is designed using a silicone gel binder that imparts inherent tack typical of standard thermal gap fillers. The filler particle composition provides both excellent thermal conductivity and good EMI suppression in the microwave frequency range, with ideal attenuation performance at or above 5GHz. Laird Technologies CoolZorb 500 Hybrid Thermal / EMI Absorbers are used as a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or metal chassis.

CoolZorb Hybrid Thermal EMI Absorbers

Laird Technologies CoolZorb Thermal Interface is a traditional thermal interface material between a heat source, such as an IC, and a heat sink, another heat transfer device, or a metal chassis. Laird CoolZorb suppresses unwanted energy coupling, resonances, or surface currents, causing board-level EMI issues. The hybrid absorber/thermal management material of the CoolZorb series is designed using a silicone gel binder that imparts inherent tack, typical of standard thermal gap fillers. The filler particle composition imparts thermal conductivity and EMI suppression in the microwave frequency range with high attenuation performance at or above 3GHz. CoolZorb passes UL 94V-0 requirements and is RoHS and REACH compliant.

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