170071-2011

Name: Molex 170071-2011
Brand: Molex
SKU: 538-170071-2011
Price: 413.22 HKD
Availability: InStock

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Mouser 編號：

538-170071-2011

製造商編號：

170071-2011

製造商：

Molex

說明：

I/O 連接器 zSFP+ Stacked 2X2 w/ 4 Light Pipes

規格書:

170071-2011 規格書

ECAD模型:

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庫存量: 16

庫存：: 16 可立即送貨

發生意外錯誤了。請稍後再試。

數量超過16會受到最小訂單要求的限制。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$413.22	HK$413.22
	HK$380.18	HK$3,801.80
	HK$338.83	HK$8,470.75
	HK$314.50	HK$15,725.00
	HK$314.42	HK$22,638.24

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商品屬性	屬性值	選擇屬性
製造商:	Molex
產品類型:	I/O 連接器
RoHS:
產品:	I/O Connectors
性別:	Female
定位數:	80 Position
間距:	0.8 mm
額定電壓:	30 VAC
觸點电镀:	Gold
安裝風格:	PCB Mount
終端類型:	Press Fit
裝配角:	Right Angle
系列:	170071
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
封裝:	Tray
品牌:	Molex
色彩:	Black
組裝國家:	Not Available
擴散國:	Not Available
原產國:	ID
额定电流:	500 mA
易燃性等級:	UL 94 V-0
產品類型:	I/O Connectors
原廠包裝數量:	72
子類別:	I/O Connectors
公司名稱:	ZXP
每件重量:	51.854 g

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所選屬性: 0

篩選文檔:

規格書

170071-2011 規格書

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

zSFP+ 2-by-1 Stacked Integrated Cages

Molex zSFP+ 2-by-1 Stacked Integrated Cages offer superior signal integrity (SI), mechanical and electrical performance, and reduced resonance. The cages support current 10Gbps Ethernet and 16Gbps Fibre Channel applications and 25Gbps data-rate requirements. The cages feature a next-generation terminal and host footprint design and offer compact space savings and ease of processing in press-fit applications. Molex zSFP+ 2-by-1 Stacked Integrated Cages feature a low-profile metal-finger version allowing for tighter cage-to-cage pitch and a height is slightly lower than the standard version.

資料/運算解決方案

Molex資料/運算解決方案可流暢整合伺服器、工作站、網路硬體與儲存裝置。Molex資料與運算解決方案採用快速、精巧且高效率的設計，具有優異的訊號完整度，能滿足目前技術的高速與高密度需求。此系列提供的解決方案還包含纜線組件、連接器、軟性扁線、功率連接器、多光纖解決方案等。Molex資料/運算解決方案系列適用於從物聯網到傳統網路效能等各種應用。

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).