170335-5607

Molex
538-170335-5607
170335-5607

製造商：

說明：
高速/模組連接器 Impact BP 4x16 85ohm GR Sn

規格書:
ECAD模型:
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供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 140   多個： 140
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$246.11 HK$34,455.40
HK$232.54 HK$65,111.20

商品屬性 屬性值 選擇屬性
Molex
產品類型: 高速/模組連接器
RoHS:  
Headers
192 Position
12 Row
1.35 mm, 1.9 mm
Through Hole
Gold
170335
Tray
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Current Rating: 750 mA
Housing Color: Gray
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
原廠包裝數量: 140
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 30 V
每件重量: 8.470 g
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所選屬性: 0

規格書

Models

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

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