171224-4012

Name: Molex 171224-4012
Brand: Molex
SKU: 538-171224-4012
Price: 892.77 HKD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

538-171224-4012

製造商編號：

171224-4012

製造商：

Molex

說明：

I/O 連接器 zSFP+ Stacked, 2X4 W/Metal, w/inner LP

規格書:

171224-4012 規格書

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Molex 171224-4012的資訊

庫存量: 36

庫存：: 36 可立即送貨

發生意外錯誤了。請稍後再試。

數量超過36會受到最小訂單要求的限制。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$892.77	HK$892.77
	HK$808.68	HK$8,086.80
	HK$658.75	HK$13,175.00
	HK$604.58	HK$60,458.00

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Molex
產品類型:	I/O 連接器
RoHS:
產品:	I/O Connectors
性別:	Female
定位數:	160 Position
間距:	0.8 mm
額定電壓:	30 VAC
觸點电镀:	Gold
安裝風格:	Panel Mount
終端類型:	Through Hole
裝配角:	Right Angle
系列:	171224
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
品牌:	Molex
色彩:	Black
觸點材料:	Copper Alloy
組裝國家:	Not Available
擴散國:	Not Available
原產國:	ID
额定电流:	500 mA
特徵:	Stacked Ganged Assembly with Metal Spring Fingers, with inner light pipes
易燃性等級:	UL 94 V-0
外殼材料:	Thermoplastic
端口數:	8 Port
產品類型:	I/O Connectors
原廠包裝數量:	1
子類別:	I/O Connectors
公司名稱:	zSFP+
類型:	ZXP zSFP+
每件重量:	94.706 g

找到產品:

若要顯示類似商品，請選取至少一個核選方塊

至少選中以上一個核取方塊以顯示在此類別中類似的產品。

所選屬性: 0

篩選文檔:

規格書

171224-4012 規格書

Models

PCN

RoHS Certificate (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).

zSFP+ 2-by-1 Stacked Integrated Cages

Molex zSFP+ 2-by-1 Stacked Integrated Cages offer superior signal integrity (SI), mechanical and electrical performance, and reduced resonance. The cages support current 10Gbps Ethernet and 16Gbps Fibre Channel applications and 25Gbps data-rate requirements. The cages feature a next-generation terminal and host footprint design and offer compact space savings and ease of processing in press-fit applications. Molex zSFP+ 2-by-1 Stacked Integrated Cages feature a low-profile metal-finger version allowing for tighter cage-to-cage pitch and a height is slightly lower than the standard version.

資料/運算解決方案

Molex資料/運算解決方案可流暢整合伺服器、工作站、網路硬體與儲存裝置。Molex資料與運算解決方案採用快速、精巧且高效率的設計，具有優異的訊號完整度，能滿足目前技術的高速與高密度需求。此系列提供的解決方案還包含纜線組件、連接器、軟性扁線、功率連接器、多光纖解決方案等。Molex資料/運算解決方案系列適用於從物聯網到傳統網路效能等各種應用。