171224-6031

Molex
538-171224-6031
171224-6031

製造商：

說明：
I/O 連接器 zSFP+Stckd 2x6 metal Vents w/Inner LP

規格書:
ECAD模型:
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供貨情況

庫存：
暫無庫存
工廠前置作業時間：
最少： 24   多個： 24
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$898.86 HK$21,572.64
HK$873.70 HK$41,937.60
120 報價

商品屬性 屬性值 選擇屬性
Molex
產品類型: I/O 連接器
RoHS:  
Jack (Female)
240 Position
0.8 mm
30 VAC
Gold
Right Angle
171224
- 40 C
+ 85 C
品牌: Molex
色彩: Black
組裝國家: Not Available
擴散國: Not Available
原產國: CN
额定电流: 500 mA
易燃性等級: UL 94 V-0
產品類型: I/O Connectors
原廠包裝數量: 24
子類別: I/O Connectors
每件重量: 141 g
找到產品:
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所選屬性: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

zSFP+ 2-by-1 Stacked Integrated Cages

Molex zSFP+ 2-by-1 Stacked Integrated Cages offer superior signal integrity (SI), mechanical and electrical performance, and reduced resonance. The cages support current 10Gbps Ethernet and 16Gbps Fibre Channel applications and 25Gbps data-rate requirements. The cages feature a next-generation terminal and host footprint design and offer compact space savings and ease of processing in press-fit applications. Molex zSFP+ 2-by-1 Stacked Integrated Cages feature a low-profile metal-finger version allowing for tighter cage-to-cage pitch and a height is slightly lower than the standard version.

資料/運算解決方案

Molex資料/運算解決方案可流暢整合伺服器、工作站、網路硬體與儲存裝置。Molex資料與運算解決方案採用快速、精巧且高效率的設計，具有優異的訊號完整度，能滿足目前技術的高速與高密度需求。此系列提供的解決方案還包含纜線組件、連接器、軟性扁線、功率連接器、多光纖解決方案等。Molex資料/運算解決方案系列適用於從物聯網到傳統網路效能等各種應用。

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).

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