171395-5608

Molex
538-171395-5608
171395-5608

製造商:

說明:
高速/模組連接器 IMPEL 6Px16 BP ASSY GDR 5.50-0.36

壽命週期:
Mouser新產品
ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存:
0

您仍可購買此商品作為延期交貨訂單。

工廠前置作業時間:
44 週 工廠預計生產時間數量大於所顯示的數量。
此產品已報告長備貨期。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$282.85 HK$282.85
HK$240.44 HK$2,404.40
HK$229.58 HK$5,739.50
HK$222.19 HK$11,109.50

商品屬性 屬性值 選擇屬性
Molex
產品類型: 高速/模組連接器
RoHS:  
Headers
192 Position
12 Row
1.9 mm
Through Hole
Gold
171395
Tray
品牌: Molex
觸點材料: High Performance Alloy (HPA)
組裝國家: Not Available
擴散國: Not Available
原產國: SG
额定电流: 750 mA
外殼顏色: Black
外殼材料: Thermoplastic (TP)
絕緣電阻: 90 Ohms
最高工作溫度: + 85 C
最低工作溫度: - 55 C
裝配角: Vertical
定位: Straight
產品類型: High Speed / Modular Connectors
原廠包裝數量: 84
子類別: Backplane Connectors
公司名稱: Impel
額定電壓: 29.9 VAC/DC
每件重量: 15.787 g
找到產品:
若要顯示類似商品,請選取至少一個核選方塊
至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

Impel™背板互連系統

Molex Impel™背板互連系統具備領先業界的訊號完整性及密度,也為日後提升資料傳輸速率提供了可升級的價格與性能。Impel™背板互連系統的尺寸與介面可讓客戶轉移至更快的資料傳輸速率(40 Gbps),不需徹底重新設計架構或更換資料中心既有的硬體,同時還能滿足業界持續推動的機械密度需求。Impel™背板連接器系統與客製化纜線組件,讓OEM可選擇在現今的資料傳輸速率與成本下操作設備。
了解更多