似乎你已停用瀏覽器的JavaScript。除非你登入，否則此頁面上的某些功能將無法使用。

171722-1003

Name: Molex 171722-1003
Brand: Molex
SKU: 538-171722-1003
Price: 388.97 HKD
Availability: OutOfStock

影像僅供參考
請參閱產品規格

Mouser 編號：

538-171722-1003

製造商編號：

171722-1003

製造商：

Molex

說明：

I/O 連接器 zQSFP+ Stkd 2x1 wEMI Sprng Fngr LP DU

規格書:

171722-1003 規格書

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Molex 171722-1003的資訊

供貨情況

庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 11 週工廠預計生產時間。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$388.97	HK$388.97
	HK$338.17	HK$3,381.70
	HK$290.25	HK$7,256.25
	HK$290.17	HK$13,928.16
	HK$284.82	HK$27,342.72
	HK$276.60	HK$79,660.80
528	報價

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Molex
產品類型:	I/O 連接器
RoHS:
REACH - SVHC:
產品:	Connectors
性別:	Female
定位數:	76 Position
間距:	0.8 mm
額定電壓:	30 V
觸點电镀:	Gold
安裝風格:	Through Hole
終端類型:	SMD/SMT
裝配角:	Right Angle
系列:	171722
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
封裝:	Tray
品牌:	Molex
色彩:	Black
觸點材料:	Copper Alloy
組裝國家:	Not Available
擴散國:	Not Available
原產國:	ID
额定电流:	500 mA
易燃性等級:	UL 94 V-0
外殼材料:	Thermoplastic
端口數:	2 Port
產品類型:	I/O Connectors
原廠包裝數量:	48
子類別:	I/O Connectors
公司名稱:	zQSFP+
類型:	zQSFP
每件重量:	34.608 g

找到產品:

若要顯示類似商品，請選取至少一個核選方塊

至少選中以上一個核取方塊以顯示在此類別中類似的產品。

所選屬性: 0

篩選文檔:

規格書

171722-1003 規格書

Models

PCN

Global Change Notification (PDF)

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zQSFP+ EMI Cages

Molex zQSFP+ EMI Cages are designed with an advanced heat-sink system to provide a high level of heat dissipation for next-generation system power levels. The die-cast design features a screw-down option to the PCB for maximum board retention. The spring-finger design provides optimal EMI grounding and allows for more space to route high-speed traces.

zQSFP+ I/O Connectors

Molex zQSFP+ interconnect solution conforms to SFF-8665 QSFP28 and is designed for high-density interconnect applications. Components of the system include SMT connectors and stacked integrated 2-by-1, 2-by-2, and 2-by-3 connectors and cages. Molex zQSFP+ SMT connectors support 100Gbps Ethernet and 100Gbps InfiniBand (IB) Enhanced Data Rate (EDR) applications.