Name: Molex 90130-1218
Brand: Molex
SKU: 538-90130-1218
Price: 45.54 HKD
Availability: InStock

說明：

集管和線殼 18CKT VERT DR HDR SHROUDED

Pricing (HKD)

數量	單價	總價
	HK$45.54	HK$45.54
	HK$38.63	HK$386.30
	HK$35.92	HK$898.00
	HK$35.51	HK$1,775.50
	HK$32.88	HK$3,288.00
	HK$31.24	HK$7,810.00
	HK$29.26	HK$14,630.00
	HK$25.98	HK$25,980.00
	HK$24.41	HK$61,025.00

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商品屬性	屬性值	選擇屬性
製造商:	Molex
產品類型:	集管和線殼
RoHS:
產品:	Headers
類型:	Shrouded
定位數:	18 Position
間距:	2.54 mm (0.1 in)
排數:	2 Row
行距:	2.54 mm (0.1 in)
安裝風格:	Through Hole
終端類型:	Solder Pin
裝配角:	Straight
聯繫人性別:	Pin (Male)
觸點电镀:	Gold
配接柱長度:	6.75 mm (0.266 in)
終端長度:	2.9 mm (0.114 in)
系列:	90130
公司名稱:	C-Grid
應用:	Wire-to-Board, Signal
最低工作溫度:	- 55 C
最高工作溫度:	+ 125 C
封裝:	Tray
品牌:	Molex
觸點材料:	Tin
組裝國家:	Not Available
擴散國:	Not Available
原產國:	SG
额定电流:	3 A
易燃性等級:	UL 94 V-0
外殼顏色:	Black
外殼材料:	Polyester
產品類型:	Headers & Wire Housings
原廠包裝數量:	1
子類別:	Headers & Wire Housings
額定電壓:	350 VAC/DC
零件號別名:	0901301218
每件重量:	2.068 g

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所選屬性: 0

篩選文檔:

規格書

90130-1218 規格書

Models

RoHS Certificate (PDF)

CNHTS:: 8536901100
TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3^rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.