90152-2216

Molex
538-90152-2216
90152-2216

製造商：

說明：
集管和線殼 C-Grid PCB Conn DR H n DR Horz Au-E 16Ckt

規格書:
ECAD模型:
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庫存量: 148

庫存：
148 可立即送貨
數量超過148會受到最小訂單要求的限制。
最少： 1   多個： 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$26.88 HK$26.88
HK$24.50 HK$245.00
HK$23.18 HK$625.86
HK$21.54 HK$2,326.32
HK$18.82 HK$5,081.40
HK$15.95 HK$8,182.35
HK$14.63 HK$15,010.38
HK$14.22 HK$35,706.42
HK$13.89 HK$69,755.58

商品屬性 屬性值 選擇屬性
Molex
產品類型: 集管和線殼
RoHS:  
Headers
Socket
16 Position
2.54 mm (0.1 in)
2 Row
2.54 mm (0.1 in)
Through Hole
Solder Pin
Right Angle
Socket (Female)
Gold
2.9 mm (0.114 in)
90152
C-Grid
Board-to-Board, Signal
- 55 C
+ 125 C
Tube
品牌: Molex
觸點材料: Tin
組裝國家: Not Available
擴散國: Not Available
原產國: ID
额定电流: 3 A
外殼顏色: Black
外殼材料: Polyester
產品類型: Headers & Wire Housings
原廠包裝數量: 27
子類別: Headers & Wire Housings
額定電壓: 350 V
零件號別名: 0901522216
每件重量: 1.664 g
找到產品:
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所選屬性: 0

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

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