APF6-025-03.5-STL-06-0-S-TR Samtec

說明：

板對板及夾層連接器 0.635 mm Pitch AcceleRate HP High-Performance Array Socket

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	板對板及夾層連接器
產品:	Socket Array
定位數:	25 Position
間距:	0.635 mm (0.025 in)
排數:	6 Row
終端類型:	Solder
裝配角:	Vertical
觸點电镀:	Gold
觸點材料:	Copper
外殼材料:	Liquid Crystal Polymer (LCP)
系列:	APF6
封裝:	Reel
品牌:	Samtec
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
易燃性等級:	UL 94 V-0
產品類型:	Board to Board & Mezzanine Connectors
原廠包裝數量:	125
子類別:	Board to Board & Mezzanine Connectors
公司名稱:	Accelerate HP

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規格書

APF6-025-03.5-STL-06-0-S-TR 規格書 (PDF)

56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay^® Extreme Performance (EP) and AcceleRate^® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

APF6與APM6 AcceleRate®高效能陣列

Samtec APF6與APM6 AcceleRate^®高效能陣列為0.635 mm間距的互連元件，具有112 Gbps PAM4的極致效能，採用彈性的開放式腳位區域設計。這些陣列為高密度的4列設計，每列有10至100個位置，並計畫擴展至1000個以上腳位。這些裝置既低矮又輕薄纖細，高5 mm、寬5 mm，非常適合空間受限的應用。Samtec APF6與APM6 AcceleRate高效能端子支援112Gbps PAM4 (56Gbps NRZ) 應用，並相容於PCIe^® 6.0/CXL^® 3.2及100GbE標準。