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LPAM-30-01.0-L-06-2-K-TR

Name: Samtec LPAM-30-01.0-L-06-2-K-TR
Brand: Samtec
SKU: 200-LPAM30010L062KTR
Price: 149.36 HKD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-LPAM30010L062KTR

製造商編號：

LPAM-30-01.0-L-06-2-K-TR

製造商：

Samtec

說明：

板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

規格書:

LPAM-30-01.0-L-06-2-K-TR 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Samtec LPAM-30-01.0-L-06-2-K-TR的資訊

庫存量: 178

庫存：: 178 可立即送貨

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 3 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$149.36	HK$149.36
	HK$142.78	HK$1,427.80
	HK$137.44	HK$3,436.00
	HK$127.41	HK$6,370.50
	HK$109.41	HK$10,941.00
完整捲（訂購多個325）
	HK$93.13	HK$30,267.25
	HK$79.65	HK$51,772.50
2,275	報價

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	板對板及夾層連接器
RoHS:
產品:	Headers
定位數:	180 Position
間距:	1.27 mm (0.05 in)
排數:	6 Row
終端類型:	Crimp
裝配角:	Vertical
堆疊高度:	4 mm, 4.5 mm
额定电流:	2.2 A
額定電壓:	250 VAC
最高數據率:	28 Gbps
最低工作溫度:	- 55 C
最高工作溫度:	+ 125 C
觸點电镀:	Gold
觸點材料:	Copper Alloy
外殼材料:	Liquid Crystal Polymer (LCP)
系列:	LPAM
封裝:	Reel
封裝:	Cut Tape
應用:	Power, Signal
品牌:	Samtec
組裝國家:	Not Available
擴散國:	Not Available
原產國:	US
數據率:	28 Gbps
產品類型:	Board to Board & Mezzanine Connectors
原廠包裝數量:	325
子類別:	Board to Board & Mezzanine Connectors
公司名稱:	LP Array
每件重量:	5.643 g

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所選屬性: 0

篩選文檔:

Specification Sheets

Technical Resources

Test Report (PDF)

CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).