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QTS-025-01-F-D-GP

Name: Samtec QTS-025-01-F-D-GP
Brand: Samtec
SKU: 200-QTS02501FDGP
Price: 60.42 HKD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-QTS02501FDGP

製造商編號：

QTS-025-01-F-D-GP

製造商：

Samtec

說明：

板對板及夾層連接器 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip

規格書:

QTS-025-01-F-D-GP 規格書 (PDF)

ECAD模型:

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更多資訊

瞭解更多關於Samtec QTS-025-01-F-D-GP的資訊

庫存量: 35

庫存：: 35 可立即送貨

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工廠前置作業時間：: 3 週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$60.42	HK$60.42
	HK$57.29	HK$572.90
	HK$54.83	HK$1,370.75
	HK$51.54	HK$4,535.52
	HK$43.32	HK$11,436.48
	HK$36.74	HK$19,398.72
	HK$30.74	HK$31,108.88
	HK$25.24	HK$51,085.76

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	板對板及夾層連接器
RoHS:
產品:	Headers
定位數:	50 Position
間距:	0.635 mm (0.025 in)
排數:	2 Row
終端類型:	Solder
裝配角:	Straight
额定电流:	1.8 A
額定電壓:	285 VAC
最低工作溫度:	- 55 C
最高工作溫度:	+ 125 C
觸點电镀:	Gold
觸點材料:	Phosphor Bronze
外殼材料:	Liquid Crystal Polymer (LCP)
系列:	QTS
封裝:	Tray
應用:	Power, Signal
品牌:	Samtec
組裝國家:	Not Available
擴散國:	Not Available
原產國:	CR
易燃性等級:	UL 94 V-0
安裝風格:	Mounting Peg
產品類型:	Board to Board & Mezzanine Connectors
原廠包裝數量:	44
子類別:	Board to Board & Mezzanine Connectors
公司名稱:	Q Strip

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所選屬性: 0

篩選文檔:

CNHTS:: 8536901900
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Q Strip™ High-Speed Mezzanine Connectors

Samtec Q Strip™ High-Speed Mezzanine Connectors are designed for high-speed board-to-board applications where signal integrity is essential. Q Strip connectors have surface-mount signal contacts and a surface-mount ground plane between the two rows of signals for improved electrical performance. Mated sets of Samtec Q Strip connectors are available in 8 different stack heights from 5mm (.197") to 30mm (1.180"). Options include guideposts for blind mate scenarios and alignment pins and locking clips for proper connector placement before reflow.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

Q Strip QTS High-Speed Ground Plane Headers

Samtec Q Strip QTS High-Speed Ground Plane Headers feature a 0.635mm pitch, a 285V_AC voltage rating, and current rating of 1.8A per pin. The QTS series is an Extended Life Product (E.L.P.™) and is compatible with UMPT/UMPS for flexible two-piece power/signal solutions. These modules provide high-speed channel performance and up to 250 positions with 5mm to 16mm stack heights. Samtec Q Strip QTS High-Speed Ground Plane Headers operate in the -55°C to +125°C temperature range.

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.