2274845-1

TE Connectivity
571-2274845-1
2274845-1

製造商:

說明:
I/O 連接器 CFP2 RECEPTACLE ASSEMBLY

ECAD模型:
下載免費的庫載入器,為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

庫存量: 382

庫存:
382 可立即送貨
工廠前置作業時間:
7 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$305.95 HK$305.95
HK$260.08 HK$2,600.80
HK$248.49 HK$6,212.25
HK$247.01 HK$12,350.50
HK$241.91 HK$24,191.00
HK$232.05 HK$69,615.00
600 報價

商品屬性 屬性值 選擇屬性
TE Connectivity
產品類型: I/O 連接器
RoHS:  
CFP Connectors
Female
104 Position
0.6 mm
Gold
Mounting Peg
SMD/SMT
Right Angle
CFP2
- 55 C
+ 85 C
品牌: TE Connectivity
觸點材料: Copper Alloy
組裝國家: Not Available
擴散國: Not Available
原產國: CN
數據率: 25 Gb/s
外殼材料: Liquid Crystal Polymer (LCP)
端口數: 1 Port
產品類型: I/O Connectors
原廠包裝數量: 300
子類別: I/O Connectors
類型: Receptacle
每件重量: 4.570 g
找到產品:
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所選屬性: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
TARIC:
8536699099
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

CFP2 & CFP4 Pluggable I/O Connectors & Cages

TE Connectivity's CFP2 and CFP4 Pluggable I/O Connectors and Cages transfer data 2.8 times faster than current CFP connectors. CFP2 and CFP4 achieve 28Gbps per lane for greater than 100Gbps Ethernet (and other protocols) in a high density, 0.6mm contact pitch. These TE connectors provide excellent signal integrity and feature a ruggedized cage construction, helping ensure reliable connections. Applications include carrier networks and datacenters, metro area networks, and high-capacity multi-100Gbps links.

CFP Compliant Ethernet Connectors

TE Connectivity's CFP Compliant Ethernet Connectors meet the requirements of the CFP MSA specification. The CFP compliant connector is an ultra-high speed pluggable I/O interface supporting 40 Gb/s and 100 Gb/s ethernet applications. The 148 position plug connector straddle mounts to the Optical Transceiver module PCB and the receptacle connector is SMT processed to the host board for conventional processing. TE's CFP Compliant Ethernet Connectors and Components are designed to support belly-to-belly port positioning for high density and provides EMI shielding at the host connector interface.