LMV824MT/NOPB
影像僅供參考
請參閱產品規格
請參閱產品規格
926-LMV824MT/NOPB
LMV824MT/NOPB
製造商：
說明：
運算放大器 - 運放器 Lo Vtg Lo Pwr RRO 5M Hz Op Amp A 926-LMV A 926-LMV824MTX/NOPB
運算放大器 - 運放器 Lo Vtg Lo Pwr RRO 5M Hz Op Amp A 926-LMV A 926-LMV824MTX/NOPB
規格書:
庫存量: 10,751
-
庫存：
-
10,751 可立即送貨發生意外錯誤了。請稍後再試。
-
工廠前置作業時間：
-
6 週 工廠預計生產時間數量大於所顯示的數量。
Pricing (HKD)
| 數量 | 單價 |
總價
|
|---|---|---|
| HK$16.85 | HK$16.85 | |
| HK$12.49 | HK$124.90 | |
| HK$10.19 | HK$254.75 | |
| HK$9.62 | HK$904.28 | |
| HK$9.45 | HK$2,664.90 | |
| HK$9.12 | HK$5,143.68 | |
| HK$8.47 | HK$8,757.98 | |
| HK$8.22 | HK$20,862.36 | |
| HK$8.08 | HK$41,014.08 |
備用包裝
相似產品
Texas Instruments
運算放大器 - 運放器 Quad 5.5-V 5.6-MHz R RO operational am A A 926-LMV824MT/NOPB
規格書
Images
PCN
- Add Cu as Alternative Wire Base Metal for Selected Device(s) (PDF)
- Packing Material change for Select Devices on TSSOP Package (PDF)
- Process change notifiation (PDF)
- Product Change Notification (PDF)
- Qualification of copper wire as alternate bonding material for selected products in TSSOP Package (PDF)
- Qualification of copper wire as alternate bonding material for selected products in TSSOP Package (PDF)
- Qualification of selected TSSOP devices in TI Malaysia (PDF)
- Replacing Tungsten at Metal One with standard aluminum metallization architecture on select devices in the CS80 Fab process at Maine Fab (PDF)
SPICE Models
- CNHTS:
- 8542339000
- CAHTS:
- 8542330000
- USHTS:
- 8542330001
- JPHTS:
- 8542330996
- KRHTS:
- 8532331000
- MXHTS:
- 8542330201
- ECCN:
- EAR99
