conga-HPC/mRLP-CSP-B
787-049252
conga-HPC/mRLP-CSP-B
製造商：
說明：
CPU和晶片散熱器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
CPU和晶片散熱器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
壽命週期:
新產品:
該製造商的新產品。
庫存量: 2
-
庫存：
-
2 可立即送貨發生意外錯誤了。請稍後再試。
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工廠前置作業時間：
-
14 週 工廠預計生產時間數量大於所顯示的數量。
此產品免費航運
Pricing (HKD)
| 數量 | 單價 |
總價
|
|---|---|---|
| HK$560.93 | HK$560.93 | |
| HK$504.71 | HK$5,047.10 | |
| HK$471.50 | HK$11,787.50 | |
| HK$464.84 | HK$23,242.00 |
- CAHTS:
- 8473309000
- USHTS:
- 8473305100
- JPHTS:
- 847330090
- MXHTS:
- 8473300499
- ECCN:
- EAR99
