Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD® is formulated to address the demands of high power density designs found in hyper-scale and cloud-scale data centers. Bergquist TGP 12000ULM features high thermal conductivity and ultra-low modulus thermal interface material (TIM). These design features make the TGP 12000ULM ideal for modern datacom applications. Among the highest-performing TIMs available on the market, TGP 12000ULM combines high thermal conductivity of 12.0W/m-K with soft, conforming properties to ensure excellent wet out at the interface for optimized thermal transfer and low assembly stress. TGP 12000ULM is built on a silicone-based resin platform with unique filler technology to accommodate excellent heat dissipation while simultaneously reducing stress on small-footprint, miniaturized components.
Features
Low assembly stress due to ultra-low modulus of 75 hardness (Shore 000, ASTM D2240) and 173kPA Young’s Modulus (ASTM D575)
Excellent conformability to rough or irregular surfaces
Thorough wet out at the interface for maximized thermal transfer
High thermal conductivity of 12.0W/m-K (ASTM D5470)
Simplified application and processability
Supplied in pre-cut, custom-sized pads with high tack on both sides
Ability to use a single pad for multi-height chips and/or multiple devices
