AB7050HF

Name: 3M AB7050HF
Brand: 3M Electronic Specialty
SKU: 517-AB7050HF
Price: 926.81 HKD
Availability: InStock

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請參閱產品規格

Mouser 編號：

517-AB7050HF

製造商編號：

AB7050HF

製造商：

3M Electronic Specialty

說明：

EMI墊圈、墊片、減震器和屏蔽 EMI Absorber AB7050HF, 210 mm x 297 mm

規格書:

AB7050HF 規格書 (PDF)

ECAD模型:

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庫存量: 240

庫存：: 240

可立即送貨

發生意外錯誤了。請稍後再試。
在途量:: 150
工廠前置作業時間：: 14

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
	HK$926.81	HK$926.81
	HK$778.76	HK$7,787.60
	HK$731.83	HK$36,591.50
	HK$731.74	HK$73,174.00
250	報價

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商品屬性	屬性值	選擇屬性
製造商:	3M
產品類型:	EMI墊圈、墊片、減震器和屏蔽
RoHS:
產品類型:	EMI Gaskets, Sheets & Absorbers
產品:	Absorbers
類型:	Absorber Sheets & Tiles
安裝風格:	Acrylic Adhesive PSA Nonconductive
長度:	210 mm
寬度:	297 mm
厚度:	0.5 mm
系列:	AB7000HF
品牌:	3M Electronic Specialty
組裝國家:	Not Available
擴散國:	Not Available
原產國:	KR
材料:	Acrylic
原廠包裝數量:	50
子類別:	EMI/RFI
零件號別名:	7100084010 WX300944146
每件重量:	149.685 g

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所選屬性: 0

篩選文檔:

規格書

AB7050HF 規格書 (PDF)

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CNHTS:: 3824999999
USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.

EMI/EMC Electronic Solutions

3M Electronic Specialty EMI/EMC Electronic Solutions are highly versatile and appropriate for diverse applications, including automotive and defense electronics. These electronics feature EMI shielding tapes, EMI grounding adhesives and gaskets, EMI absorbers, flux field directional materials, and NFC, wireless power, magnetic shielding materials.