The production process for the Bourns Model SRF1260 and SRF1280 Series Dual-Winding Shielded Power Inductors will be modified to reduce the amount of epoxy applied between the inductor core and shield. Currently, the inductor core and shield are held together with epoxy that is manually applied completely around the core. The production process will now be automated to apply the epoxy in four spots to bond the core and shield.
This Product Change Notification reflects an anticipated positive change to reliability. The reduction in the amount of epoxy in between the core and shield, which will create free space for material thermal expansion, should help reduce the risk of core cracking during the reflow soldering process.
Implementation dates are as follows: Date deliveries of modified products will begin: May 1, 2013 Date manufacturing of existing product will cease: April 30,2013 The first date code using the above changes will be 1314.
Qualification test data is available upon request.
Please contact a Mouser Technical Sales Representative for further assistance.
Bourns Magnetic Products are engineered to meet essential power application requirements for power conversion, isolation, EMC compliance, signal integrity, and increased power density. Bourns offers a broad, proven, and continually expanding portfolio of miniaturized, automotive grade, high quality, and high-reliability components. Bourns Magnetic Products are key elements in many of today’s breakthrough designs, such as electric vehicles, high power battery charging, e-mobility, renewable energy, energy storage, the Internet of Things (IoT), and industrial infrastructure.
The production process for the Bourns Model SRF1260 and SRF1280
Series Dual-Winding Shielded Power Inductors will be modified to
reduce the amount of epoxy applied between the inductor core and
shield. Currently, the inductor core and shield are held
together with epoxy that is manually applied completely around
the core. The production process will now be automated to apply
the epoxy in four spots to bond the core and shield.
This Product Change Notification reflects an anticipated
positive change to reliability. The reduction in the amount of
epoxy in between the core and shield, which will create free
space for material thermal expansion, should help reduce the
risk of core cracking during the reflow soldering process.
Implementation dates are as follows:
Date deliveries of modified products will begin: May 1, 2013
Date manufacturing of existing product will cease: April 30,2013
The first date code using the above changes will be 1314.
Qualification test data is available upon request.
Please contact a Mouser Technical Sales Representative for
further assistance.
5-1012-25