所有結果 (1,058)

電腦模組 - COM COM Express Mini Type10 module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz 2MB L2 cache 8GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.

散熱器 HSP COMe-mAL10 E2 thread

電腦模組 - COM COMe-mRP10 E2 i7-1365URE 32GB

電腦模組 - COM SMARC 2.1 module with Intel Atom x6425E quad core processor with 2.0GHz core frequency up to 3.0GHz, 1.5MB cache, 16GB 3200MT/s LPDDR4x onboard memory and 64GB eMMC onboard flash.

電腦模組 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

開發板及套件 - 其他處理器 COM-HPC Client 3.5 carrier board suitable for congatec COM-HPC modules with Size M (Mini).

CPU和晶片散熱器 HSP COMe-cAP6 Cu-core threaded

電腦模組 - COM COM Express Type 6 Compact module based on Intel Core i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

開發板及套件 - 其他處理器 congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40 C to 85 C

電腦模組 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

模組配件 The conga-DP/HDMI adapter 4k is used for evlauation of the DP/HDMI graphics interface of x86 Qseven and COM Express modules in combination with the congatec evaluation carrier boards conga-QEVAL and conga-TEVAL. It supports full 4k display resolution

CPU和晶片散熱器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.