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DF300R07W2H3B77BPSA1

Name: Infineon DF300R07W2H3B77BPSA1
Brand: Infineon Technologies
SKU: 726-DF300R07W2H3B77B
Price: 521.23 HKD
Availability: InStock

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Mouser 編號：

726-DF300R07W2H3B77B

製造商編號：

DF300R07W2H3B77BPSA1

製造商：

Infineon Technologies

說明：

IGBT 模組 EASY

規格書:

DF300R07W2H3B77BPSA1 規格書 (PDF)

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庫存量: 9

庫存：: 9 可立即送貨

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單價:

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總價:

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Pricing (HKD)

數量	單價	總價
	HK$521.23	HK$521.23
	HK$454.65	HK$4,546.50

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商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	IGBT 模組
產品:	IGBT Silicon Modules
配置:	3-Phase Inverter
集電極-發射極最大電壓VCEO:	650 V
集電極-發射極飽和電壓:	1.68 V
連續集電極電流在25 C:	150 A
柵射極漏電電流:	100 nA
最低工作溫度:	- 40 C
最高工作溫度:	+ 150 C
封裝:	Tray
品牌:	Infineon Technologies
組裝國家:	Not Available
擴散國:	Not Available
原產國:	AU
產品類型:	IGBT Modules
系列:	EasyPACK 2B
原廠包裝數量:	15
子類別:	IGBTs
技術:	Si
公司名稱:	EasyPACK
零件號別名:	DF300R07W2H3_B77 SP005423516

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篩選文檔:

規格書

DF300R07W2H3B77BPSA1 規格書 (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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USHTS:: 8541290065
TARIC:: 8541290000
ECCN:: EAR99

EasyPACK™ 2B IGBT Power Modules

Infineon Technologies EasyPACK™ 2B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages do not have a base plate, enabling use in various applications. In PIM or Six-Pack configurations, the Infineon EasyPACK 2B IGBT power modules cover the full power range from 20A to 200A at 600V/650V/1200V. These modules also have a power dissipation range from 20mW to 600W and operate from -40°C up to +150°C or +175°C.

Reliable & Efficient Power Supply for Data Centers

Infineon Technologies Reliable and Efficient Power Supply for Data Centers are scalable solutions with power ratings from approximately 5kW to 50/60kW. This Infineon solution is ideal for uninterruptible power supplies (UPS) that require high power density and energy efficiency. These modules leverage various chip technologies, including Si IGBT, CoolSiC™ hybrid, and CoolSiC MOSFET, to meet diverse requirements for cost-effectiveness and performance. Infineon's portfolio addresses all system levels of a UPS with different voltage classes, and are set to expand offerings to include lower power rating classes.

650V 3-level IGBT Modules

Infineon Technologies 650V 3-level IGBT Modules are EasyPACK™ modules with Trench/Fieldstop technology. These modules feature low inductive design, low switching losses, and low V_CE(sat). The IGBT modules provide Al₂O₃ substrate with low thermal resistance, compact design, PressFIT contact technology, and rugged mounting due to integrated mounting clamps. Potential applications include three-level applications, motor drives, solar applications, and UPS systems in EasyPACK™ modules.