-ar 多協議模組

結果: 197
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 封裝
Quectel 多協議模組 Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1庫存量
最少: 1
倍數: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Espressif Systems 多協議模組 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
最少: 1
倍數: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
CEL 多協議模組 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3庫存量
最少: 1
倍數: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Ezurio 多協議模組 Bluetooth Module, BL54L15 , Bluetooth LE, nRF4L15 chip
最少: 1
倍數: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Quectel 多協議模組 Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 34庫存量
最少: 1
倍數: 1
: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Ezurio 多協議模組 Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
最少: 1
倍數: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多協議模組 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
最少: 1
倍數: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多協議模組 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
最少: 1
倍數: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Microchip Technology 多協議模組 Bluetooth Low Energy/Zigbee Combo Module with PCB Antenna and extended temperature
最少: 1
倍數: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics 多協議模組 Type 2FR module
最少: 1
倍數: 1
: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Quectel 多協議模組 Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
最少: 1
倍數: 1
: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel
Quectel 多協議模組 Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
最少: 1
倍數: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Quectel 多協議模組 Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY!
最少: 1
倍數: 1
: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel 多協議模組 Cat M1/Cat NB2, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency)
最少: 1
倍數: 1
: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel 多協議模組 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
最少: 1
倍數: 1
: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Silicon Labs 多協議模組 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 無庫存前置作業時間 12 週
最少: 2,500
倍數: 2,500
: 2,500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists 多協議模組 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Embedded Artists 多協議模組 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA 無庫存前置作業時間 3 週
最少: 1
倍數: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs 多協議模組 Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module 無庫存前置作業時間 12 週
最少: 1
倍數: 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Silicon Labs 多協議模組 Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module 無庫存前置作業時間 12 週
最少: 1
倍數: 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Silicon Labs 多協議模組 Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module 無庫存前置作業時間 12 週
最少: 1,000
倍數: 1,000
: 1,000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel
Silicon Labs 多協議模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 無庫存前置作業時間 12 週
最少: 1
倍數: 1

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多協議模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 無庫存前置作業時間 12 週
最少: 1
倍數: 1
: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink 多協議模組 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 無庫存前置作業時間 6 週
最少: 1
倍數: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Ezurio 多協議模組 Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip 無庫存前置作業時間 16 週
最少: 1
倍數: 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape