congatec CPU和晶片散熱器

結果: 101
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JUMPtec CPU和晶片散熱器 HSP COMe-bV26 Cu-core threaded 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-bV26 Cu-core through 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-bTL6 Cu-core threaded 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-bTL6 Cu-core through 無庫存前置作業時間 24 週
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-bID7 (E2) Cu-core threaded 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-bID7 (E2) Cu-core through 無庫存前置作業時間 24 週
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMh-sdID (E2) thread 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMh-sdID (E2) through 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 Cooling COMh-sdID (E2): Adapter 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 Cooling COMh-sdID (E2): Backplate 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 Cooling COMh-sdID (E2): Cooler-LGA115x 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMh Size D Active Uni Cooler (w/o HSP) 暫無庫存
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 COMh Size D Passive Uni Cooler (w/o HSP) 暫無庫存
最少: 1
倍數: 1

congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 *Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5 暫無庫存
最少: 1
倍數: 1

conga-PA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. thread 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are M2.5 threaded 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 * Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole 暫無庫存
最少: 1
倍數: 1
conga-SA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 無庫存前置作業時間 14 週
最少: 1
倍數: 1
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3