CPU和晶片散熱器

結果: 302
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DFRobot CPU和晶片散熱器 ICE Tower Cooler for Raspberry Pi 5 Single Board Computer 暫無庫存
最少: 240
倍數: 1

40 mm 35 mm Efficient Cooling
APC by Schneider Electric CPU和晶片散熱器 InRow RD, 300mm, Air Cooled, 220-240V, 50Hz
300 mm 300 mm 220 VAC to 240 VAC
APC by Schneider Electric CPU和晶片散熱器 InRow RD, 300mm, Fluid Cooled, 220-240V, 50Hz
300 mm 300 mm 220 VAC to 240 VAC
Seeed Studio CPU和晶片散熱器 ICE Tower CPU Cooling Fan for Raspberry Pi (Support Pi 5) 暫無庫存
最少: 1
倍數: 1

40 mm 35 mm Compact Design, Cooling Performance
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded. 暫無庫存
最少: 1
倍數: 1
conga-QA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 *Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5 暫無庫存
最少: 1
倍數: 1

conga-PA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. thread 暫無庫存
最少: 1
倍數: 1
conga-TCA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are M2.5 threaded 暫無庫存
最少: 1
倍數: 1
conga-MA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 * Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole 暫無庫存
最少: 1
倍數: 1
conga-SA7 Intel Elkhart Lake
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 無庫存前置作業時間 14 週
最少: 1
倍數: 1
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
24.3 mm conga-TC570 Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
29 mm 12 VDC conga-HPC/cTLH Intel Tiger Lake-H
congatec CPU和晶片散熱器 Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. 暫無庫存
最少: 1
倍數: 1
29 mm 12 VDC conga-HPC/cTLH Intel Tiger Lake-H
congatec CPU和晶片散熱器 Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole. 暫無庫存
最少: 1
倍數: 1
28 mm conga-HPC/cTLH Intel Tiger Lake-H